EIA/JESDAB. Page 1. TEST METHOD AB. POWER AND TEMPERATURE CYCLING. (From Council Ballot JCB, formulated under the. Find the most up-to-date version of JESDAA at Engineering 4. Power Temp. Cycling. (PTC) JESDA /+°C, If = 20mA on/off = 5min. hrs. 5. Steady state life test. (SSLT) JESDA

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When testing a10 devices it is important to avoid transient thermal gradients in the samples on test. Power supplies and biasing networks shall be capable of maintaining the specified operating conditions throughout the testing period despite normal variations in line voltages or ambient temperatures.

Direct heat conduction to sample s shall be minimized.

JESDAC-Power and Temperature Cycling_百度文库

The time at the high and low temperature extremes shall be sufficient to allow the total mass of each device under test to reach the specified temperature extremes with no power applied. The test circuitry should also be designed so that existence of abnormal or failed devices does not alter the specified a1055 for other units on test. Sockets or other mounting means shall be nesd22 within the chamber so that reliable electrical contact can be made to the device terminals in the specified circuit configuration.

The electrical measurements shall consist of parametric and functional tests specified in the applicable specification. Rec ommend a tions fo r cor rec tion: It is intended to simulate worst case conditions encountered in typical applications. If liquid nitrogen LN2 is used, care must be taken to avoid direct exposure of the parts and boards to the LN2.


Mechanical damage shall not include damage induced by fixturing or handling or the damage is not critical to the package performance in the specific application.

JESDAB – Test Method AB, Power and Temperature Cycling

It is intended for device qualification. Deviations must be corrected prior to further cycling to assure the validity of the qualification data. Ramp rate can be load dependent and should be verified for the load being tested. The test setup should be monitored initially and at the conclusion of a test interval to establish that all devices are being stressed to the specified requirements.

A combined power cycle O ther su gges tio ns for d ocu men t impro vemen t: JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

The power and temperature cycling test shall be continuous except when parts are removed from the chamber for interim electrical measurements. NOTE Power duty cycle is usually expressed as a percentage.

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For samples without a thermal mass constraint, the ramp rate can be faster. Samples with large thermal mass and low heat transfer efficiency require ramp rates slow enough to compensate for the thermal aa105. IGBT Power cycling and The power and temperature cycling test is considered destructive. I rec ommen d cha nges to the fo llow in g: The device shall be subjected to the test conditions derived from Jesd2 1 as illustrated in Figure 1.


These include flip chip, ball grid array and stacked packages with solder interconnections. During the test, the power applied to the devices shall be alternately cycled 5 minutes on 5 minutes off unless otherwise specified in the applicable specification. By downloading this file the individual agrees not to charge q105 or resell the resulting material. The power should then be applied and suitable checks made to assure that all devices are properly biased. Care should be taken to avoid possible damage from transient voltage spikes or other conditions that might result in electrical, thermal, or mechanical x105.

A combined power and e Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. Cycle ramp rate and soak time are more significant for solder interconnections. Effect of YMnO3 on the The low temperature to high temperature transition or reverse sequence is acceptable. a10

No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.